The PAINE Conference provides a unique venue to researchers and practitioners from academia, industry, and government to have productive dialog concerning the physical inspection of electronics. This area has grown significantly over the past decade (there were more than 300 attendees in 2020) and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The complex long life of the electronic devices coupled with their diverse applications are making them increasingly vulnerable to various forms of threats and inspection. Large industry and government efforts have been put in place across the globe to address related supply chain security problems to offer solutions, training and services. The number of programs introduced by US government have increased over the years to analyze and develop relevant solutions. Although much focus is given to digital domain, physical assurance and inspection of electronics as well as physical fingerprinting based on analog parameters are rapidly providing opportunities for unique countermeasures.
The PAINE Conference was founded by Dr. Asadi and Dr. Mark Tehranipoor in 2018 as a collocated workshop with the DAC Conference, but quickly became a free-standing, independent conference. Tehranipoor is serving as the general chair for the 2021 conference.
The PAINE 2021 program promises scores of interesting talks by researchers and program managers from entities such as: New York University, Purdue University, Intel, DARPA, the US Navy, Facebook, AWS, NIST, and SRC. A full list of speakers is available here.