“3D-Printed mm-Wave Devices and Circuits for System-in-a-Package Applications”
Thursday, Feb. 27, 1:00 pm
This invited talk will present our recent research towards strategic design, additive manufacturing (AM also known as 3D printing), and characterization of devices, interconnects and circuits for the emerging mm-Wave and sub-THz system-in-a-package (SiP) applications. This talk begins with a brief overview of our research activities for development of a diverse library of well-characterized functional materials suited for additive manufacturing of mm-W devices, interconnection and packaging of integrated circuits (MMIC’s). The newly developed feedstock composites exhibit promising EM properties (r=4~12 and tand <0.002) well suited for applications ranging from RF to mmW frequencies (with tested properties up to 110 GHz). The 3D printed transmission lines and probe pads can be re-rendered to reach µm scale accuracy by laser trimming to facilitate on-package probe testing. The frequency response of a custom-designed distributed amplifier with a fully 3D printed chip assembly have been characterized between 1 GHz and 30 GHz, which exhibit much better wideband performance than an identical QFN-packaged amplifier. On-package probe measurements of a 3D printed microstrip line has exhibited low insertion losses of 0.028 dB/mm at 5 GHz and 0.187dB/mm at 20 GHz, while CPW lines show an insertion loss lower than 0.34 dB/mm at 110 GHz. More recently, design and implementation of W-band 80-100 GHz Tx/Rx modules with in-house designed 3-stage LNA via OMMIC’s foundry service has been demonstrated by direct print additive manufacturing. This talk also presents a comprehensive study of the design of a multilayer dielectric rod waveguide (DRW), which is comprised of a high permittivity core encased by a low permittivity cladding. The insertion loss of the multi-layer DRW is less than 0.012 dB/mm at Ku-band frequencies and as low as 0.4 dB/mm at WR6 band (110-170 GHz). A dielectric rod antenna (DRA) that consists of a medium permittivity dielectric rod core encased by a low permittivity cladding is also designed to raise the peak gain by 3-9 dB at 30-40 GHz.
Dr. Jing Wang is a professor and the director of Center for Wireless and Microwave Information Systems (WAMI) in the Department of Electrical Engineering at the University of South Florida, which he joined in 2006. He received dual B.S. degrees in both Electrical Engineering and Mechanical Engineering from Tsinghua University in 1999. He received two M.S. degrees, one in electrical engineering, the other in mechanical engineering, and a Ph.D. degree from the University of Michigan in 2000, 2002, 2006, respectively. His research interests include RF/microwave/mmW devices, advanced additive manufacturing, micromachined transducers, RF/Bio-MEMS, lab-on-a-chip and microfluidics, functional nanomaterials. His research work has been funded by grants from federal agencies (NSF, DTRA, US Army, US Air Force) and contracts from more than a dozen companies totaling over $13M. He has published more than 160 peer-reviewed papers and holds 11 US patents. He serves as the chairperson for IEEE MTT/AP/EDS Florida West Coast Section and he has been elected as a member of the IEEE MTT-Technical Coordinating Committee on RF Acoustics. He has chaired IEEE Wireless and Microwave Technology Conference (WAMICON) between 2011 and 2014. It is worth mentioning that WAMICON is an IEEE MTT-s sponsored international annual conference, which has been organized by USF WAMI Center in the last 20 years. In 2014, he chaired WAMICON 2014, which was jointly held with International Microwave Symposium (IMS 2014) in Tampa.